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The Testing & Application Center signed cooperation agreement for test project with Shenzhen Institute of Beijing University

Release date: 2014-09-11 15:06:30 Browse the number:0

October 6, 2012, the Power Device Testing & Application Center signed cooperation agreement for test project with Shenzhen Institute of Beijing University. It agreed that the center will undertake testing and evaluation tasks of Shenzhen Institute of Beijing University in the latest project, the researching and development of new power device. The two sides both will keep long-term cooperation in the field of power device & power management IC research, charge and discharge technology, etc.

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